Specifications |
| Main Board/ Memory |
·Intel® LGA1151 6th,7th,8th Generation CPU, B365 Chipset
·2 x DDR4 SO-DIMM socket, support up to 32 GB 2133/1866/2400MHz |
·Intel® LGA1150 CPU, H81 Chipset
·1 x DDR3 SO-DIMM socket, support up to 8 GB DDR3 1333/1066 SDRAM memory module |
| Storage |
·1 x mSATA+1 x 2.5" SATA HDD drive bay |
| Expansions |
•1 x Full-size Mini-PCIe for SSD/WIFI/3G/4G LTE |
| •1 x Full-size PCI slot or PCI-Express 2.0 16x |
| Lan |
•2*RTL8111E, 10/100/1000M, Support PXE, Wake on Lan |
| Audio |
•Realtek ALC662 |
| Watchdog Timer |
•255 levels, 0~255 sec |
| BIOS |
•AMI 32MB Flash ROM |
| I/O Interface-Front |
•Power on/ off switch |
| Operating Temperature |
·Ambient with air flow: -10°C to 60°C |
| Storage Temperature |
·-40 to +80 ° |
| Relative humidity |
·10% to 93% (Non-condensing) |
| Anti-Vibration |
·5Hz~500Hz/1Grms/3Axis |
| Anti-Shock |
·15G, 11ms Duration |
| I/O Interface-Rear |
·2 x USB 2.0+ 2 x USB 3.0 |
| ·2 x RJ45 |
| ·1 x VGA |
| ·1 x HDMI |
| ·1 x Headphone-out |
| ·1 x MIC-in |
| ·10x COM |
| ·1 x Antenna holes (Either optional Wi-Fi or Mobile wireless module) |
| Power Requirements |
·12V DC-IN(Standard) / 8V~28V Input(Optional) |
| Dimensions |
·276 mm (W) x 195 mm (D) x 132mm (H) |
| Construction |
·Aluminum Chassis with fanless design |
![[!---class.name--]](/skin/moban/npic/pro_tu.jpg)
